xMEMS Introduces Solid-State Micro-Cooling to Edge AI and Data Centers

Announced today, the company’s new PiezoMEMS air movers reach subsystems that conventional fans and cold plates can’t.As compute proliferates across everyday devices, cooling remains a major design challenge. To solve that, xMEMS Labs today announced the start of mass production for its XMC-2400 and XMC-4800 µCooling chips.